Ultratech Inc. Q3 2009 Earnings Call Transcript

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2009-10-15 14:24:07.0

Tags: Revenue, Bank, Call Transcript, Uniformity, Earnings, Chip, Ultratech Inc., Semiconductors, Financial Services, Network Technology, Hardware, Networking, Seeking Alpha

Question-and-Answer Session

Operator

(Operator Instructions) Your first question comes from Krish Sankar - Bank of America/Merrill Lynch.

Krish Sankar - Bank of America/Merrill Lynch

I had a couple of questions, Art. The first one on the advanced packaging side, are you seeing most of these orders are related to the traditional flip chip application adoption or is it more you’re seeing like new applications like through silicon via for your flip chip steppers?

Art Zafiropoulo

Most of them are for the existing AP applications and bump. However, there is lots of interest for TSC that we expect to grow next year and the year after, but TSC probably won’t reach a peak until 2011, but it will see growth next year in that area, but this quarter, primarily they were in the bump area, wafer level CSP.

Krish Sankar - Bank of America/Merrill Lynch

Then on the LSA side, the technology leaders today are making decisions for 22 nanometers. Can you talk a little bit about how you are positioned in those spaces given that there has been recent speculation that there has been some lack of penetration at some of the leading chipmakers?

Art Zafiropoulo

I think it’s awful early. We certainly are in facilities that are currently using our tool at 32 and 28 and they’re doing advanced research at 22, but it’s a little bit early on 22 at this moment, but I think there we’re very strong at 32 and 28, both in metal gate and in silicon gate. So we feel very comfortable that we will get more than our fair share at 22. This technology, as you go to smaller nodes, gets stronger and stronger due to reduced stresses and uniformity and edge exclusion as I outlined in our new LSA101.

Competitive tools have serious edge exclusion problems and uniformity thermal issues on the outside of the wafer and had very high stresses, which cause for dislocations and slip, which allows for poor yield in lithography. So that we think that as it moves to 22 and sub 22, that our technology will become more preferred than any other competing technology.

Krish Sankar - Bank of America/Merrill Lynch

The final question for Bruce, you guided to about 10% to 15% improvement in the second half. That essentially is kind of like flattish revenue from Q3 to Q4. Given the strength in the bookings, couldn’t that revenue be much higher in Q4, are most of those bookings going to taper off into Q1 revenues at this point?

 

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