Question-and-Answer Session
Operator
(Operator Instructions). Your first question comes from Chris Blansett with JP Morgan. Your line is open.
Chris Blansett
Hi, guys. Thanks for taking my question. I wanted to kind of get a status check of how your different product lines are doing in the field, meaning from more of a utilization perspective, with all the negative news flow out there about a slow down in tech, I wanted to see how things are trending specifically for your different products and how you think that's going to impact you over the next, say, couple of quarters?
Art Zafiropoulo
Okay, this is Art. Chris, thanks for the question. Let me take it from the advanced packaging area and two parts of it. One is in the bumping area for wafers and the other is in the gold bumping for the flat panel displays. The flat panel display area is still a bit of a problem, and we do expect a little bit of business next year in that area but currently it is in the 60% range, between 60 and 70% utilization. And the wafer processing and the wafer level CSP business, that is much much higher and we're seeing numbers over 90% in that area currently. So, we see no change in those projected orders for Q4 or for next year at the current time. So the advanced packaging area is looking quite strong and then new applications as I mentioned earlier should begin to increase in 2009.
In the laser technology area, in the 65 nanometer node, the systems are being utilized fairly heavily. Again, it is the second generation technology node, not the first. And so I'd give you a guess in excess of 80%. And depending upon which companies in the 45 nanometer node, can we go back to 55 for a minute, that we do have some companies running in the 90% plus range on 65. In the 45 again, they are ramping up but their plans looking forward are for expansion in the 45 as it ramps up. And they are using our systems for multi pass which means that there is more than one step of the junction formation that they using the system for, and it is up to four steps now by several companies in the world. And so the routing capacity for multi step and also for just planned 45 nanometer and 40 nanometer expansion. So in general, it is ramping up, heavier in the 65 nanometer utilization currently. Ramping up in 40, 45 nanometers and they are buying tools with expectations of the multi process steps that are required for laser.
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